Liquid cooling device

ABSTRACT

A liquid cooling device includes a water tank structure having parallel and separated first and second water tanks. The heat dissipation structure is installed between the first and second water tanks and the three are coupled to each other to form a curved cooling water passage. A mounting portion is formed in the gap between the heat dissipation structure and the first and second water tanks in the extension direction of the heat dissipation structure and the first and second water tanks. Both of the pumping structure and the endothermic structure are coupled to the first and second water tanks. The pumping structure and the endothermic structure are installed in at least one mounting portion and the pumping structure drives a working fluid to flow back and forth between the first water tank, the heat dissipation structure and the second water tank in the curved cooling water passage sequentially.

CROSS-REFERENCE TO RELATED APPLICATION

The present application is a divisional application of U.S. Ser. No.16/909,959 filed on Jun. 23, 2020. The entire disclosures of the aboveapplications are all incorporated herein by reference.

BACKGROUND OF THE INVENTION Technical Field

The technical field of this disclosure relates to heat sinks, and moreparticularly to a liquid cooling device.

Description of Related Art

In general, a conventional liquid cooling device comprises a waterchamber, a water pump, an endothermic block, and a radiator and has theeffect of using a water pump to drive a working fluid to flow, so thatthe circulation of the working fluid can dissipate the heat of a heatsource and achieve a liquid cooling effect.

However, the water tank, the water pump and the endothermic block of theconventional liquid cooling device are connected by long hoses andconnectors, and the joint between the hose and the connector becomes ahigh-risk point of leaking the working fluid, and the complicatedstructure causes a substantially larger volume that usually cannot meetthe application in a small space.

Secondly, the conventional liquid cooling device is generallymanufactured by a specific mold, and the specific mold is limited toproduce a specific product only but it is unable to freely select andchange the positions of the water pump and the endothermic deviceaccording to the using environments and requirements. For example, theposition of a heat source varies in different products. Since theendothermic block of the conventional liquid cooling device is fixed,therefore the required position cannot be selected or adjusted freely.On the other hand, the conventional liquid cooling device does not allowusers to expand or add more water pumps or endothermic blocks to copewith different using environments.

In view of the aforementioned drawbacks of the prior art, the discloserof this disclosure based on years of experience in the related industryto conduct extensive research and experiment, and finally provided afeasible solution to overcome the drawbacks of the prior art.

SUMMARY OF THE INVENTION

Therefore, it is a primary object of this disclosure to provide a liquidcooling device with a compact structure and reduced volume.

To achieve the aforementioned and other objectives, this disclosurediscloses a liquid cooling device , comprising: a water tank structure,having a first water tank and a second water tank for storing anddispatching a working fluid of the liquid cooling device; a heatdissipation structure, installed between the first water tank and thesecond water tank and coupled to each other to form a curved coolingwater passage, and the heat dissipation structure being provided forexchanging heat absorbed by the working fluid with the outside todissipate the heat; a mounting portion, formed at a gap between the heatdissipation structure and the first water tank and the second watertank, and formed side-by-side in an extending direction of the heatdissipation structure and the first water tank and the second watertank; a pumping structure, coupled to the first water tank and thesecond water tank; and an endothermic structure, coupled to the firstwater tank and the second water tank; wherein the pumping structure andthe endothermic structure are installed in the at least one mountingportion, and the pumping structure drives the working fluid to flow backand forth between the first water tank, the heat dissipation structureand the second water tank sequentially in the curved cooling waterpassage.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a perspective view of a liquid cooling device in accordancewith a first embodiment of this disclosure;

FIG. 2 is a partial exploded view showing a simple water tank structureand a heat dissipation structure in accordance with the first embodimentof the present disclosure showing;

FIG. 3 is a partial exploded view showing a complex water tank structureand a heat dissipation structure in accordance with the first embodimentof the present disclosure;

FIG. 4 is a partial exploded view showing a pumping structure, anendothermic structure and two bridges in accordance with the firstembodiment of the present disclosure;

FIG. 5 is a cross-sectional view of Section 5-5 of FIG. 1;

FIG. 6 is a cross-sectional view of Section 6-6 of FIG. 1;

FIG. 7 is a cross-sectional view of Section 7-7 of FIG. 1;

FIGS. 8A, 8B, and 8C are schematic views showing an endothermicstructure with different types of heat absorbers in accordance with thefirst embodiment of the present disclosure respectively;

FIGS. 9A and 9B are schematic views showing a fan installed at differentpositions in accordance with the first embodiment of the presentdisclosure respectively;

FIGS. 10A and 10B are perspective views of a liquid cooling device inaccordance with a second embodiment of the present disclosure;

FIG. 11 is an exploded view of a liquid cooling device in accordancewith a third embodiment of the present disclosure;

FIG. 12 is a perspective view of a liquid cooling device in accordancewith a fourth embodiment of the present disclosure;

FIG. 13 is an exploded view of a liquid cooling device in accordancewith a fifth embodiment of the present disclosure;

FIG. 14 is an exploded view of a liquid cooling device in accordancewith a sixth embodiment of the present disclosure; and

FIG. 15 is a cross-sectional view of a liquid cooling device inaccordance with a seventh embodiment of the present disclosure.

DESCRIPTION OF THE PREFERRED EMBODIMENTS

The technical contents of this disclosure will become apparent with thedetailed description of preferred embodiments accompanied with theillustration of related drawings as follows. It is intended that theembodiments and drawings disclosed herein are to be consideredillustrative rather than restrictive.

The present disclosure directs to a liquid cooling device capable ofdissipating the heat of a heat source by a working fluid, wherein FIGS.1 to 9 show the first embodiment, and FIGS. 10 to 12 show the second,third, and fourth embodiment of the present disclosure respectively.

In FIGS. 1 and 2, the liquid cooling device of the first embodiment ofthe present disclosure comprises a water tank structure 1, a heatdissipation structure 2, a pumping structure 3 and an endothermicstructure 4 and preferably further comprises a first bridge 5 a and asecond bridge 5 b.

The water tank structure 1 comprises a first water tank 11 and a secondwater tank 12 arranged side by side with each other and having aninterval apart from each other. A partitioned space 13 is definedbetween the first water tank 11 and the second water tank 12, whereinthe first water tank 11 and the second water tank 12 are provided forstoring and dispatching a working fluid of the liquid cooling device ofthe present disclosure, so as to ensure the normal operation and coolingfunction of the liquid cooling device.

The heat dissipation structure 2 is installed in the partitioned space13 and coupled to the first water tank 11 and the second water tank 12.In this embodiment, the first water tank 11 and the second water tank 12are disposed on both sides of the heat dissipation structure 2respectively. A mounting portion G is formed at the gap between the theheat dissipation structure 2 and the first water tank 11 and the secondwater tank 12.

In this disclosure, the formation of the mounting portion G is notlimited to the one as described above. In this embodiment, the mountingportion G is formed between the inner side of the first water tank 11,the inner side of the second water tank 12 and a side of the heatdissipation structure 2.

Both of the pumping structure 3 and the endothermic structure 4 aredisposed in the mounting portion G, and the pumping structure 3 iscoupled to the first water tank 11 and the second water tank 12, and theendothermic structure 4 is coupled to the first water tank 11 and thesecond water tank 12. In this embodiment, the pumping structure 3 andthe endothermic structure 4 are disposed on the same side of the heatdissipation structure, and the mounting portion G has an area greaterthan the sum of the area of the pumping structure 3 and the area of theendothermic structure 4 as shown in FIG. 1.

Since the pumping structure 3 and the endothermic structure 4 aredisposed in the mounting portion G and the mounting portion G has aremaining space for installing the pumping structure 3 and theendothermic structure 4, therefore the installation positions of thepumping structure 3 and the endothermic structure 4 in the mountingportion G can be adjusted freely according to the actual usingenvironment, before the pumping structure 3 and the endothermicstructure 4 and the first water tank 11 or the second water tank 12 areinstalled to their respective positions; and this disclosure has theeffect of preventing the pumping structure 3 and the endothermicstructure 4 from interfering with each other.

In addition, the first water tank 11 and the second water tank 12 areelongated cuboids, and the heat dissipation structure 2 is an oblongcuboid, so that the mounting portion G becomes an oblong rectangularspace. Further, the pumping structure 3 and the endothermic structure 4are small cuboid for receiving the oblong rectangular space, so that thewater tank structure 1, the heat dissipation structure 2, the pumpingstructure 3 and the endothermic structure 4 can be stackedlongitudinally and combined transversally like blocks, and the presentdisclosure provides a compact liquid cooling device with the effect ofreducing the total volume.

The water tank structure 1 and the heat dissipation structure 2 aresimple structures as shown in FIG. 2 and described below.

The simple first water tank 11 has a plurality of first upper waterchambers 11 a 1, 11 a 2 and a plurality of first lower water chambers 11b 1, 11 b 2, 11 b 3, and the water chambers of the first water tank 11can be stacked longitudinally and combined transversally like blocks, sothat an elongated rectangular first water tank 11 can be formed in thefixed volume of the water tank to obtain the largest fluid volume.Wherein, the first upper water chamber 11 a 1 and the first lower waterchamber 11 b 1 are vertically coupled to each other, and the first upperwater chamber 11 a 2 and the first lower water chamber 11 b 3 arevertically coupled to each other. The simple second water tank 12 has asecond upper water chamber 12 a 1 and a plurality of second lower waterchambers 12 b 1, 12 b 2 formed therein, and the water chambers of thesecond water tank 12 can also be stacked vertically and combinedtransversally like blocks, so that an elongated rectangular second watertank 12 can be formed in the fixed volume of the water tank to obtainthe largest fluid volume. The pumping structure 3 is coupled between thefirst upper water chamber 11 a 1 and the second upper water chamber 12 a1, and the endothermic structure 4 is coupled between the first upperwater chamber 11 a 2 and the second upper water chamber 12 a 1, and theheat dissipation structure 2 is coupled between each first lower waterchamber 11 b 1, 11 b 2, 11 b 3 and each second lower water chamber 12 b1, 12 b 2.

The simple heat dissipation structure 2 of another embodiment (not shownin the figure) is an oblong rectangular single-piece object, and each ofthe two sides of the simple heat dissipation structure 2 is coupled tothe plurality of first lower water chambers 11 b 1, 11 b 2, 11 b 3 andthe plurality of second lower water chambers 12 b 1, 12 b 2 through aplurality of interfaces respectively. In FIG. 2, the simple heatdissipation structure 2 can be formed by a plurality of cooling members211 arranged side by side with each other, and each cooling member 211is equipped with a fluid pipe 221, and each fluid pipe 221 is coupled tothe first lower water chamber 11 b 1, 11 b 2, 11 b 3 and the secondlower water chamber 12 b 1, 12 b 2.

In FIG. 2, the liquid cooling device of the present disclosure comprisesa plurality of curved water passages which will be described in detailsbelow. A first curved water passage (not labeled in the figure) isformed along a path from a pump outlet 515 of the pumping structure 3,the first upper water chamber 11 a 1, and the first lower water chamber11 b 1 coupled to the first upper water chamber 11 a 1 to a coolingliquid inlet 2211 of the heat dissipation structure 2, and the coolingliquid inlet 2211 is defined at a liquid inlet of the first coolingmember 211 of the plurality of parallel cooling members 211. A secondcurved water passage (not labeled in the figure) is formed along a pathfrom a cooling liquid outlet 2212 of the heat dissipation structure 2,the first lower water chamber 11 b 3, the first upper water chamber 11 a2 coupled to the cooling liquid outlet 2112, the endothermic structure4, and the second upper water chamber 12 a 1 to a pump inlet 516 of thepumping structure 3 coupled to the second upper water chamber 12 a 1,and the cooling liquid outlet 2212 is defined at a liquid outlet of thelast cooling member 211 of the plurality of parallel cooling members211. The working fluid in the pumping structure 3 is driven by thepumping structure 3 to curvedly flow back and forth between theplurality of first lower water chambers 11 b 1, 11 b 2, 11 b 3, theplurality of fluid pipes 221 and the plurality of second lower waterchambers 12 b 1, 12 b 2 to define a curved cooling water passage (notlabeled in the figure). In a preferred embodiment, the curved coolingwater passage is bent to at least one S-shape and coupled between thefirst curved water passage and the second curved water passage.

FIG. 3 shows a complex heat dissipation structure 2, and the detailswill be described below. The heat dissipation structure 2 comprises atop cover 23, a row of fluid pipes 22, two rows of cooling members 21and a bottom cover 24, and the row of fluid pipes 22 comprises aplurality of fluid pipes 221 arranged side by side with each other, andeach row of cooling members 21 comprises a plurality of cooling members211 arranged side by side with each other. In FIG. 5, both of the upperand lower sides of the row of fluid pipes 22 together with the top cover23 and the bottom cover 24 are provided for clamping between two rows ofcooling members 21. In a preferred embodiment, there are two rows offluid pipes 22 and three rows of cooling members 21 which are clamped bydifferent ways (as shown in FIG. 5).

In FIG. 3, the complex water tank structure 1 fits the two rows of fluidpipes 22 of the complex heat dissipation structure 2, and there are tworows of interfaces at the position of each lower water chamber. In otherwords, there is one more row of interfaces at the position of each lowerwater chamber of the simple water tank structure 1.

In FIGS. 4 to 7, the pumping structure 3 comprises a water pump seat 31and a water pump 32 combined with each other, and the water pump 32 iscoupled to the first water tank 11 and the second water tank 12 throughthe water pump seat 31. In a preferred embodiment, the water pump seat31 of the pumping structure 3 can be coupled to the water tank structure1 through the first bridge 5 a. Both ends of the first bridge 5 a arecoupled to the first water tank 11 and the second water tank 12, and thefirst bridge 5 a has a first port (not labeled in the figure), and thepumping structure 3 is configured to be corresponsive to and coupled tothe first port by the water pump seat 31. For example, the water pumpseat 31 is integrally formed with the first bridge 5 a, but thisdisclosure is not limited to such arrangement only.

The endothermic structure 4 comprises an endothermic base 41 and a heatabsorber 42 combined with each other, and the heat absorber 42 iscoupled to the first water tank 11 and the second water tank 12 throughthe endothermic base 41. In a preferred embodiment, the endothermicstructure 4 is coupled to the water tank structure 1 through the secondbridge 5 b. Both ends of the second bridge 5 b are also coupled to thefirst water tank 11 and the second water tank 12, and the second bridge5 b has a second port (not labeled in the figure), and the endothermicstructure 4 is configured to be corresponsive to and coupled to thesecond port by the endothermic base 41. For example, the endothermicbase 41 is integrally formed with the second bridge 5 b, but thisdisclosure is not limited to such arrangement only.

In detail, the water pump seat 31 has a pump chamber 311 formed thereinand configured to be corresponsive to the first port, and the firstbridge 5 a has two first chambers 51 horizontally separated from eachother, and the pump chamber 311 is coupled between the two firstchambers 51 and bent vertically up and down, so as to provide theeffects of changing the flowing direction and increasing the kineticenergy for driving the flow of the working fluid.

The endothermic structure 4 has an endothermic chamber 411 configured tobe corresponsive to the second port, and the second bridge 5 b has twosecond chambers 52 horizontally separated from each other, and theendothermic chamber 411 is coupled between the two second chambers 52and bent vertically up and down, so as to provide the effects ofchanging the flowing direction and reducing the flow rate to improve theheat exchange capacity.

It is noteworthy that the pumping structure 3 is disposed at theinstallation position of the first bridge 5 a and the endothermicstructure 4 is disposed at the installation position of the secondbridge 5 b, and these positions can be adjusted according to therequired using environment. Therefore, this disclosure has moreflexibility to make adjustment freely.

In FIG. 4, the water pump 32 comprises an inner cover 321, an impeller322, a partition plate 323, a driving member 324 and an outer cover 325.

The endothermic structure 4 further comprises a sealing member 43installed between the endothermic base 41 and the heat absorber 42 toprovide a watertight effect.

The heat absorber 42 is fixed to the endothermic base 41 by welding orscrews. In an embodiment as shown in FIG. 8A, a welded portion 44 iswelded and fixed between the endothermic base 41 and the heat absorber42, and the heat absorber 42 comprises a heat absorbing plate 421 and aplurality of fins 422 a welded onto a side of the heat absorbing plate421 a. In FIG. 8B, the fin 422 b can be a prototype of the heat absorber42. In FIG. 8C, the fin 422 c is welded or screwed to an externalstructure of heat absorber 42.

In FIGS. 9A and 9B, the liquid cooling device of the present disclosurefurther comprises a fan. In this embodiment, the fan is an axial flowfan F1 (as shown in FIG. 9A), and the fan F1 disposed on the oppositeside of the pumping structure 3 and the endothermic structure 4 isembedded into the heat dissipation structure 2. In other words, the fanF1 is embedded from the other side of the heat dissipation structure 2,and the other side of the heat dissipation structure 2 (which is thebottom cover 24) has an air slot 241. In another embodiment, the fan isa vortex fan F2 (as shown in FIG. 9B), and the fan F2 is installed at anend of the heat dissipation structure 2. In other words, the fan F2 isinstalled on the other one of the two sides of the heat dissipationstructure 2.

With reference to FIGS. 10A and 10B for a liquid cooling device inaccordance with the second embodiment of the present disclosure, thesecond embodiment is substantially the same as the first embodimentexcept that the structure of the first bridge 5 a and the second bridge5 b communicating to the water tank is different.

In FIG. 10A, two short adjacent pipes 6 a, 6 b are coupled between bothends of the first bridge 5 a and the first water tank 11 and the secondwater tank 12, and two short adjacent pipes 6 c, 6 d are coupled betweenboth ends of the second bridge 5 b and the first water tank 11 and thesecond water tank 12.

In FIG. 10B, the two short adjacent pipes 6 a, 6 b are coupled betweenan end of the first bridge 5 a and the second water tank 12, and the twoadjacent pipes 6 c, 6 d are coupled between an end of the second bridge5 b and the second water tank 12.

It is noteworthy that the two adjacent pipes 6 a, 6 b or 6 c, 6 d of theaforementioned embodiments are made of a hard material including but notlimited to metal.

With reference to FIG. 11 for a liquid cooling device in accordance withthe third embodiment of the present disclosure, the third embodiment issubstantially the same as the first embodiment except that the thirdembodiment substitutes the first bridge 5 a and the second bridge 5 b bya single bridge 5 c.

The liquid cooling device of the third embodiment of the presentdisclosure comprises a bridge 5 c with both ends coupled to the firstwater tank 11 and the second water tank 12, and the bridge 5 c has afirst port and a second port (not shown in the figure) arranged side byside with each other, and the pumping structure 3 is configured to becorresponsive to the first port by the water pump seat 31, and theendothermic structure 4 is configured to be corresponsive to the secondport by the endothermic base 41.

With reference to FIG. 12 for a liquid cooling device in accordance withthe fourth embodiment of the present disclosure, the fourth embodimentis substantially the same as the first embodiment except that there area plurality of pumping structures 3 and a plurality of endothermicstructures 4 in the fourth embodiment, wherein the pumping structures 3are installed on the same first bridge 5 a, and the endothermicstructures 4 are installed on the second bridges 5 b respectively.

With reference to FIG. 13 for a liquid cooling device in accordance withthe fifth embodiment of the present disclosure, the fifth embodiment issubstantially the same as the first embodiment except the mountingportion G, first bridge 5 a and the second bridge 5 b.

In the fifth embodiment, the mounting portion G is formed between theinner side of the first water tank 11, the inner side of the secondwater tank 12, and an end of the heat dissipation structure 2. The firstbridge 5 a and the second bridge 5 b are connected in series with eachother and jointly coupled and coupled between the first water tank 11and the second water tank 12. The pumping structure 3 and theendothermic structure 4 are installed at the first bridge 5 a and thesecond bridge 5 b respectively.

With reference to FIG. 14 for a liquid cooling device in accordance withthe sixth embodiment of the present disclosure, the sixth embodiment issubstantially the same as the first embodiment except that there are twomounting portions G in the sixth embodiment.

In the sixth embodiment, the two mounting portions G are formed betweenthe inner side of the first water tank 11, the inner side of the secondwater tank 12 and both ends of the heat dissipation structure 2. Thefirst bridge 5 a and the second bridge 5 b corresponding to eachrespective mounting portion G are coupled to the first water tank 11 andthe second water tank 12 respectively. The pumping structure 3 and theendothermic structure 4 are installed at the first bridge 5 a and thesecond bridge 5 b respectively.

With reference to FIG. 15 for a liquid cooling device in accordance withthe seventh embodiment of the present disclosure, the seventh embodimentis substantially the same as the third embodiment (as shown in FIG. 11),except that the liquid cooling device of the seventh embodiment is avertical liquid cooling device as described in details below.

The heat dissipation structure 2 is installed in the partitioned space13 (as shown in FIG. 2) and coupled to the first water tank 11 and thesecond water tank 12 to form the curved cooling water passage, whereinthe gap between the heat dissipation structure 2 and the first watertank 11 and the second water tank 12, and the heat dissipation structure2 and the first water tank 11 and the second water tank 12 arranged sideby side in an extension direction E jointly form the mounting portion G.

In this embodiment, the mounting portion G is formed at the first watertank 11, the second water tank 12 and the outer side of the bottom ofthe heat dissipation structure 2. It is noteworthy that the extensiondirection E of this embodiment refers to a range of the gap between thefirst water tank 11 and the second water tank 12 along a virtualextension direction, and the definition of this extension direction E isnot limited to its use in this embodiment, but it can be applied to eachof the aforementioned embodiments as well.

In FIG. 15, the pumping structure 3 is coupled to the first water tank11 and the second water tank 12, so that the pumping structure 3 iscoupled to the curved cooling water passage. The endothermic structure 4is coupled to the first water tank 11 and the second water tank 12, sothat the endothermic structure 4 is coupled to the curved cooling waterpassage.

Therefore, users can freely select the installation of the pumpingstructure 3 and the endothermic structure 4 to the bottom of the watertank structure 1 and the bottom of the endothermic structure 2 by usingthe bridge 5 d to achieve the same effects of the third embodiment.

In the seventh embodiment, the liquid cooling device further comprises abridge 5 d, bridge 5 d with both ends coupled to the bottom of the firstwater tank 11 and the bottom of the second water tank 12. It isnoteworthy that the first water tank 11 and the second water tank 12 arecoupled to both sides of the heat dissipation structure 2 respectivelyto form a cuboid, and the bridge 5 d supports the bottom of the cuboid.

The bridge 5 d has a first port and a second ports (which are notlabeled in the figure) are stacked vertically with respect to eachother, and the pumping structure 3 is configured to be corresponsive toand coupled to the first port by the water pump seat 31, and theendothermic structure 4 is configured to be corresponsive to and coupledto the second port by the endothermic base 41. The pumping structure 3and the endothermic structure 4 are coupled to each other through thebridge 5 d.

In addition, the first water tank 11 has an upper water chamber 115 anda lower water chamber 116 vertically stacked with respect to each other,and the second water tank 12 has a left water chamber 125 and a rightwater chamber 126 arranged side by side with each other. Wherein, theleft water chamber 125 has a height equal to the height of the firstwater tank 11, and the right water chamber 126 is coupled to the upperwater chamber 115 and the lower water chamber 116 through the heatdissipation structure 2.

Therefore, the pumping structure 3 can drive the working fluid curvedlyflow back and forth between the plurality of water chambers of the firstwater tank 11 (which are the upper water chamber 115 and the lower waterchamber 116), the plurality of fluid pipes 221 of the heat dissipationstructure 2 and the plurality of water chambers of the second water tank12 (which are the left water chamber 125 and the right water chamber126) to form the curved cooling water passage.

In summation of the aforementioned embodiments, the present disclosurehas another effect of providing different combinations and expanding thescope of application of the liquid cooling device with the cost of usingthe same mold. For example, different bridge designs including the useof the first bridge 5 a and the second bridge 5 b can be adoptedaccording to the user requirements, or a signal bridge 5 c, 5 d can beused. In addition, the connecting position between each bridge and thefirst water tank 11 and the second water tank 12 can be changedaccording to the design requirement before the bridge and the firstwater tank 11 or the second water tank 12 are welded and fixed.

According to the aforementioned embodiments of the present disclosure,the present disclosure uses the heat dissipation structure 2, thepumping structure 3, and the endothermic structure 4 together with afree selection of components including the first bridge 5 a, the secondbridge 5 b or different bridges 5 c/5 d to combine each component withthe first water tank 11, the second water tank 12, or both directly, sothat the process technology of the liquid cooling device of the presentdisclosure can avoid the risk of leakage caused by the use of long hosesand connectors for the connection, wherein this process technologyrelates to a welding process or a 3D printing process.

In summation, the present disclosure has the following advantageouseffects:

1. The liquid cooling device is integrated into a structure with asmaller volume to facilitate its applications in a compact limitedspace.

2. The singularity of the major production processes can reduce thenumber of joints of the structure and components to reduce the risk ofleaking significantly.

3. With the investment on the same set of mold, different combinationsof the quantity and position of pumping structures and endothermicstructures can be used to achieve the effects of expanding the scope ofapplications, saving costs, and improving the stability of quality.

While this disclosure has been described by means of specificembodiments, numerous modifications and variations could be made theretoby those skilled in the art without departing from the scope and spiritof this disclosure set forth in the claims.

What is claimed is:
 1. A liquid cooling device, comprising: a water tankstructure, having a first water tank and a second water tank for storingand dispatching a working fluid of the liquid cooling device; a heatdissipation structure, installed between the first water tank and thesecond water tank and coupled to each other to form a curved coolingwater passage, and the heat dissipation structure being provided forexchanging heat absorbed by the working fluid with the outside todissipate the heat; a mounting portion, formed at a gap between the heatdissipation structure and the first water tank and the second watertank, and formed side by side with each other in an extending directionof the heat dissipation structure and the first water tank and thesecond water tank; a pumping structure, coupled to the first water tankand the second water tank; and an endothermic structure, coupled to thefirst water tank and the second water tank; a bridge with both endscoupled between the bottom of the first water tank and the bottom of thesecond water tank, and the bridge having a first port and a second portvertically stacked with respect to each other, and the pumping structureand the endothermic structure being configured to be corresponsive tothe first port and the second port respectively; wherein, the pumpingstructure and the endothermic structure are installed in the at leastone mounting portion, and the pumping structure drives the working fluidto flow back and forth between the first water tank, the heatdissipation structure and the second water tank sequentially in thecurved cooling water passage, wherein the first water tank has an upperwater chamber and a lower water chamber stacked vertically with respectto each other, and the second water tank has a left water chamber and aright water chamber disposed side by side with each other, and the leftwater chamber has a height equal to the height of the first water tank,and the right water chamber is coupled to the upper water chamber andthe lower water chamber through the heat dissipation structure.
 2. Theliquid cooling device as claimed in claim 1, wherein the heatdissipation structure comprises a top cover, a row of fluid pipes, tworows of cooling members and a bottom cover, and the row of fluid pipescomprises the plurality of fluid pipes parallel to each other, and eachrow of cooling members comprises the plurality of parallel coolingmembers, and both sides of the row of fluid pipes together with the topcover and the bottom cover are clamped between the two rows of coolingmembers.